Overview
Micron Technology is offering a specialised TEM Characterisation Internship for an exceptional PhD candidate eager to contribute to next-generation semiconductor innovation. Based in Micron’s advanced YE Lab in Singapore, this role places you at the frontier of 3D Electron Tomography research, working directly with industry-leading TEM and FIB systems to solve complex nanoscale challenges.
What You’ll Get Out of This Internship
You’ll gain hands-on experience with world-class electron microscopy tools, contribute to real R&D projects shaping future memory technologies, and collaborate with multidisciplinary teams across process, device, and materials engineering. This role offers deep technical growth, strong research exposure, and the opportunity to produce high-impact findings for internal and cross-functional teams.
Key Responsibilities
- Prepare 3D NAND samples using FIB for tomography studies
- Conduct 3D TEM/STEM/EFTEM experiments, including tilt-series acquisition
- Perform tomographic reconstructions and nanoscale analysis
- Support process integration and device engineering investigations
- Document results and present technical insights
- Contribute to lab workflow improvements and safety practices
Requirements
- Current PhD candidate in Materials Science & Engineering, Applied Physics, or related fields
- Understanding of semiconductor materials and device physics
- Experience operating TEM tools (Nion, TFS, JEOL)
- Familiarity with analysis tools such as MATLAB, Python, or DigitalMicrograph
- Experience with 3D reconstruction software (Avizo, IMOD, TomoJ, etc.) preferred
- Strong analytical, communication, and problem-solving skills
Who This Internship Is Ideal For
This role fits a research-driven PhD student passionate about semiconductor materials, electron microscopy, and advanced nanoscale characterisation, seeking hands-on, publication-aligned industry experience.
About the Company
Micron Technology is a global leader in advanced memory and storage solutions, powering breakthroughs in AI, 5G, data centres, and next-generation computing.
Internship Details
- Location: Singapore
- Duration: Typically 3–6 months
- Commitment: Full-time
- Working Arrangement: On-site
- Stipend: Competitive; aligned with PhD-level internship rates
- Deadline: Applications reviewed on a rolling basis
